NTV will be attending the 31st Annual Electronics Packaging Symposium- Small Systems Integration on September 5th and 6th in Niskayuna, NY, representing all of our partners. This symposium brings together leaders in academia, industry, and government to discuss electronics packaging topics of:
- 2.5/3D Packaging
- mm Wave in Packaging
- Automotive & Harsh Environments
- Bioelectronics
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- MEMS
- Photonics
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
Come visit NTV at the symposium and become more familiar with the products and services our technological partners offer.