Unity SC combines advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market solutions. They help their customers provide the highest yield, the best quality, and the fastest throughput- all while offering the most cost-effective solution in the market.
Metrology: Combining multiple measurement technologies in one system, Unity’s unique “swiss army knife” design, is the only solution that can measure from nanometers to millimeters on silicon, as well as thick compound and all other substrates.
Inspection: The Unity product line combines Unity’s unique technologies from inspection and metrology on all types and shapes of substrates. Depending on your application, Unity will provide you a reliable and efficient solution.
Unity SC Products
A Versatile Metrology Solution
TMAP Series provides highly accurate and repeatable wafer geometry measurements. TMAP Series was designed to enable the easiest and fastest measurement for the user. TMAP Series is available in manual, semi-automatic, or full automatic configurations for wafers up to 30mm.
Modular Platform for all surface inspection: top, bottom, edge
The 4See Series ensures wafer front side, backside, and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process. The 4SEE series is built on a modular approach allowing to combine several modules depending on the customer needs.
For more information on Unity SC,
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