Metrology: Combining multiple measurement technologies in one system, Unity’s unique “swiss army knife” design, is the only solution that can measure from nanometers to millimeters on silicon, as well as thick compound and all other substrates.
Inspection: The Unity product line combines Unity’s unique technologies from inspection and metrology on all types and shapes of substrates. Depending on your application, Unity will provide you a reliable and efficient solution.
A Versatile Metrology Solution
TMAP Series provides highly accurate and repeatable wafer geometry measurements. TMAP Series was designed to enable the easiest and fastest measurement for the user. TMAP Series is available in manual, semi-automatic, or full automatic configurations for wafers up to 30mm.
Modular Platform for all surface inspection: top, bottom, edge
The 4See Series ensures wafer front side, backside, and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process. The 4SEE series is built on a modular approach allowing to combine several modules depending on the customer needs.
For more information on Unity SC,
visit their website at http://unity-sc.com/.