NextIn Solutions is a global leading company in the fields of process defect detection and metrology with its proprietary technology and development of innovative ideas in semiconductor and display industries.
With its superior defect detection technology and metrology solutions for its world-wide customers, NextIn Solutions is helping its users achieve early process stabilization from the initial R&D phase and maximize their profits during mass production.
Nextin Solutions Products
AEGIS
The cost-effective, high-performance wafer inspection system
AEGIS series provide the most cost-effective solution in defect detection for 2xnm node of semiconductor manufacturing process and beyond. It has BF(Bright Field) and DF(Dark Field) inspection capabilities. The system uses both dark field and bright field technology for both patterned and unpatterned wafers.
ASTRA 200
Advanced Solution for Semiconductor Applications
The ASTRA 200 provides inspection solutions for semiconductor applications in the AEGIS-II system. Components of this model include: 2D imaging technology, a high-power 355nm DPSS laser, exclusive dark-field inspection, bright-field review capability, one-click conversions of 200mm/300mm, semi standards compliance, and the smallest footprint. Single Objectives are: M55@38wph (Sensitivity: 100nm) or M60@wph (sensitivity: 120nm) including loading/unloading NTW@300mm
ASTRA 300
Advanced Solution for Semiconductor Applications
The ASTRA 300 provides inspection solutions for semiconductor applications in the AEGIS-II system. Components of this model include: 2D imaging technology, a high-power 355nm DPSS laser, exclusive dark-field inspection, bright-field review capability, one-click conversions of 200mm/300mm, semi standards compliance, and the smallest footprint. Single Objectives are: M35@20wph (Sensitivity: 55nm) with Option: M35@35wph (Sensitivity: 55nm) or M40@22wph (Sensitivity: 65nm) with Option: M35@40wph (Sensitivity: 55nm) including loading/unloading NTW@200mmA
IRIS
The Wafer Metrology-Inspection System
IRIS utilizes NextIn’s patent-awarded technology called Multiple Off-focus Image Process Technology to measure the vertical structures and find pattern defects during the HAR process steps in 3D semiconductor devices, as well as TSV processing in the Advanced 3D Packaging processes.
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